SEMI Standards support to make 3D Packaging/
WLP etc and manufacturing lines smarter.
3D Packaging & Integration
FO-PLP used materials such as encapsulants, PLP FOUP and PLP panels are exhibited in the booth. SEMI related documents and PLP technical documents are displayed in the booth.
How Industry Standards are helped to accelerate the PLP wider adoption in the market?
10:20-11:10, Thursday, December 13
Information & Control（I&C）
Introduction on SEMI Standards, which make semiconductor manufacturing line smarter; “GEM300” Standards, “EDA (equipment data acquisition)” Standards, and “GEM300A” Standards including the Standard for secured and operation-oriented recipe management.
#SECS, #DataAcquisition, #FabControl, #Recipe, #Security, #FabOperation
SEMI Factory Automation Standards, the Enabler of Smarter Fab Operation
11:20-12:10, Wednesday, December 12
Introduction on advanced M2M interface “SEMI A1 Horizontal Communication” which makes flow-shop type manufacturing line smarter by “Simultaneous transportation of material and its data” and “Autonomous cooperation among equipment”.
#FlowShopLine, #ObjectOriented, M2Minterface, #SMEMA, #SMT, #PCB
SEMI A1, A Smart M2M Interface to Realize Connected Factory
11:20-12:10, Thursday, December 13
East Hall 2
Booth No. 2751
SEMICON Japan 2018 Show Management Support (Sakura International Inc.)
Tel : +81-50-5804-1281
*Available Mon - Fri (except holidays) from 9:30 - 12:00/13:00 - 17:30 (local time)
Email : email@example.com