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Tech Spot

Tech Spot

 

TechSTAGNORTH  

Date: Wednesday, Dec.13 - Friday, Dec 15 10:20-16:50
Venue: Tokyo Big Sight

TechSPOT   (East Hall 4)

TechSPOT WEST  (East Hall 1)

TechSPOT INNOVATION&IOT(East Hall 3)

Explore in-depth information of products and technologies beyond the booth at exhibitor presentations available in the Exhibitor Seminar Rooms and on TechSPOT stages on the show floor. Participation in all the seminars is free.

 

Exhibiting company

TechSPOT
(East Hall 4)

Wednesday, Dec 12 10:20
|
11:10
SAFE TECHNO LIMITED  Safety Design Update
11:20
|
12:10
Minimal Fab General Incorporated Association  Model Cases of Minimal Fab Business
12:40
|
13:30
Minimal Fab General Incorporated Association  Application Examples for Making Devices using Minimal Fab
13:40
|
14:30
Hitachi High-Technologies Corporation  Challenges and solutions of CD-SEM based Edge Placement Error (EPE) metrologies
15:00
|
15:50
Kanken Techno.Co.,Ltd. Introductions of innovative total solutions in the sub-fab area and Kanken Techno abatement systems
16:00
|
16:50
Yokogawa Solution Service Corporation  Developments in overseas expansion for minimal fab
Thursday, Dec 13
10:20
|
11:10
Yokogawa Solution Service Corporation  Business models using minimal fab
11:20
|
12:10
Kanken Techno.Co.,Ltd. Introductions of innovative total solutions in the sub-fab area and Kanken Techno abatement systems
12:40
|
13:30
Hitachi High-Technologies Corporation  Challenges and solutions of CD-SEM based Edge Placement Error (EPE) metrologies
13:40
|
14:30
HORIBA Advanced Techno.Co,LTD  HORIBA measurement technology proposal for advanced Semiconductor process.
15:00
|
15:50
EVGroup Japan K.K.  EVG's Latest Bonding Technoligies for 'Heterogeneous Integration'
16:00
|
16:50
Evatec AG  Evatec – At the Heart of the IOT
Friday, Dec 14
10:20
|
11:10
Evatec AG  Bringing Semiconductor Standards to Optics
11:20
|
12:10
HORIBA STEC, Co., Ltd.  Solving your legacy tool troubles! Proposal for life time/ size and cost reduction/maintenance.
12:40
|
13:30
Connectec Japan  Realize the future of sensing devices with OSRDA service centered on low temperature mounting
13:40
|
14:30
Hitachi High-Technologies Corporation  ‘’Mirelis’’ for non-destructive inspection of crystal defects and latent scratches in SiC wafers.
15:00
|
15:50
TUV Rheinland Japan Ltd.  SEMI S2, S8, S22:2018 Introduction and Q&A
16:00
|
16:50
Otsuka Electronics Co., Ltd.  Introduction of a new thickness measurement for in-situ and in-line in the manufacturing process

 

TechSPOT WEST
(East Hall 1)

Wednesday, Dec 12 10:20
|
11:10
MIRAI PROGRAM @ GAKKO Overview of Semiconductor Device Fabrication Process - presented by SEMI
11:20
|
12:10
TBA TBA
12:40
|
13:30
TBA TBA
13:40
|
14:30
Tohoku University Tanaka Shuji Laboratory MEMS and LSI technologies for leading the upcoming edge era - MEMS-LSI integrated tactile sensors -
15:00
|
15:50
TBA TBA
Thursday, Dec 13
10:20
|
11:10
TBA TBA
11:20
|
12:10
Silicon Saxony Management GmbH TBA
12:40
|
13:30
TBA TBA
13:40
|
14:30
Nanofabrication Platform Consortium  Introduction of Nanofabrication platform
15:00
|
15:50
Holland High Tech Pavilion  Holland High Tech Pavilion Seminar – Get inspired by Dutch High Tech
Friday, Dec 14
10:20
|
11:10
MIRAI PROGRAM @ GAKKO Overview of Semiconductor Device Fabrication Process - presented by SEMI
11:20
|
12:10
Otsuka Electronics Co., Ltd.  Introduction of a new thickness measurement for in-situ and in-line in the manufacturing process
12:40
|
13:30
TBA TBA
13:40
|
14:30
Preferred Networks, Inc. TBA
15:00
|
15:50
Deloitte Tohmatsu LLC  TBA

 

TechSPOT INNOVATION&IOT
(East Hall 3)

Wednesday, Dec 12 11:20
|
12:10
SEMI Standards: Information & Control SEMI Factory Automation Standards, the Enabler of Smarter Fab Operation
12:40
|
13:30
Cimetrix TBA
13:40
|
14:30
Mitsubishi Electric Corporation TBA
15:00
|
15:50
kobe sekkei room co,ltd.  TBA
Thursday, Dec 13
10:20
|
11:10
SEMI Standards: 3D Packaging and Integration How Industry Standards are helped to accelerate the PLP wider adoption in the market?
11:20
|
12:10
SEMI Standards: Automation Technology SEMI A1, A Smart M2M Interface to Realize Connected Factory
12:40
|
13:30
Peer Group Cybersecurity for OEMs: protecting your tools against cyber threats
13:40
|
14:30
Tokyo Instruments, Inc.  Statistical process control in compound semiconductor manufacturing by wafer cathodoluminescence
15:00
|
15:50
Photo electron Soul Inc. The introduction of the next generation e-beam gun with semiconductor photocathode technology
Friday, Dec 14
10:20
|
11:10
IBM Research - Tokyo TBA
11:20
|
12:10
MULTISOUP CO., LTD.  Smart Factry:Indoor Positioning Technologies and Systems "iField indoor"
12:40
|
13:30
Ball Wave Inc  TBA
13:40
|
14:30
ADVANCED-KEY-TECHNOLOGY LABORATORIES CORPORATION  "Advanced Pedestal Method" and "Advanced Floating-Zone method" for high quality crystal material
15:00
|
15:50
LAPIS Semiconductor Co., Ltd.  TBA

 

ATTENTION : No Interpretation Available

Please note that using English is recommended for presentation materials,
but some presentation materials are written in Japanese.

 


Question ?

SEMICON Japan Show Management Support (Sakura International Inc.)
Tel : +81-50-5804-1281
*Available Mon - Fri (except holidays) from 9:30 a.m. - Noon/1:00 p.m. - 5:00 p.m. (local time)
Email : semicon@sakurain.co.jp

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