Apply to Exhibit

Simply follow these 3 easy steps


1.  View FloorPlan and Select Booth Loccation

2.  Submit online Application

3.  Email/Fax the signed form to SEMI JAPAN

Booth Fee & Payment Due

>> Click Here.



Application Schedule

  Onsite-booth Selection

  December 13-15, 2017

in Special meeting room  (OSS Office)

  1st Exhibitor Applications

  January 4 - July 31, 2018

exhibitors choose a booth location

  2nd Exhibiotr Applications

  after July 31, 2018

exhibitors choose a booth location


Event Overview: SEMICON Japan 2018

SEMICON Japan 2018

December 12-14, 2018

Tokyo Big Sight, East Hall 1-5


■ Main Exhibit Zone

Front-End Process Zone

  • Design Tools
  • Wafer Manufacturing Equipment
  • Wafer Process Equipment

Components & Materials Zone

Back-end / Overall Process Zone

  • Packaging Equipment
  • Test & Inspection Equipment
  • Fab Facility & Related Equipment
  • Fab & Packaging Materials
  • Softwares & Services



IoT solution, application, device, equipment, components, software and service providers and manufacturers in the following areas:


Smart Manufacturing

Smart Automotive



■ Pavilion Exhibit Zone 

>> Manufacturing Innovation Pavilion

  • Advanced Lithography: EUV, nanoimprint, DSA, multi-patterning
  • Advanced mounting technology, 2.5d, 3D IC: TSV, plating
  • Production management systems & solutions: Defect control and inspections, yield management, automation
  • Precision work technology, special materials: Non-magnetic, lightweight, heat-resistant, corrosion-proof, particle countermeasures
  • Flexible electronics, OLED, LED, and related technologies: Manufacturing technologies, devices, materials


For inquiries, contact:

SEMI Japan Customer Services

Tel: +81. 3.3222.5988



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